Trainings Available

Date & Time
Tuesday, April 28, 2026, 8:30 AM - 5:00 PM
Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Name
Overview of Semiconductor Manufacturing
Price
$695.00
Date & Time
Thursday, April 30, 2026, 8:30 AM - 5:00 PM
Description

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry. 
Course tropics include: 
- Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
- Process Nodes: Process nodes and their impact on device performance and cost-
- Device Physics and Transistor Operation: Principles of device operation and transistor functionality
- Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
- Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
- Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
- Wafer Processing:
     -Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
     -Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
     -Etching and Cleaning Processes: Plasma and wet etching processes
     -Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
     -Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance- 
     -Electroplating and Sputtering: Metal deposition techniques used in manufacturing
     -Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
     -Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
-Semiconductor Industry Ecosystem: The major players in the industry 

Ready to Join a SEMI U Training Couse?

Attendees are welcome to attend this program as a one day only pass for $795. Alternately, a session can be added to a Heartland Pass for $695. Students and veterans will have a further discounted rate of $595 on offer with the Career Explorer Pass.