The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.

The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies. Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Learning Objectives:

• Understand the fundamental principles and theories semiconductor technology.
• Communicate with other associates and understand wafer processing steps.
• Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
• Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device.
• Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
• Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
• Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
• Analyze and evaluate research literature in semiconductor technology.
• Develop critical thinking and problem-solving skills applicable to semiconductor technology.

This course addresses IC packaging, assembly, and chip/substrate interconnections. It stresses the impact of the IC and end product requirements, i.e., “smaller, better, cheaper” and their influence on the manufacturing processes. Topics include all types of packages including ball grid arrays, flip chip, fanout, leadframe, stacked die, stacked packages, System-in-Package, and chip scale packages, and assembly technologies – Chip & Wire, Tape Automated Bonding, and Flip Chip.  The growing importance of packaging as a way to deliver high integration and performance in today's products through heterogeneous integration of chiplets or 3D hybrid bonding will be discussed. This course is suitable for anyone seeking a better understanding of the assembly and packaging of semiconductor devices.

Learning Objectives:

• Recognize advanced packaging trends of emerging technologies and market demand and drivers
• Identify types of semiconductor packaging including different packaging techniques and selection criteria
• Classify material properties and applications and thermal and mechanical properties for packaging
• Explain assembly techniques and equipment including key assembly processes and equipment and tooling requirements
• Discover reliability and testing protocols including stress testing and failure analysis
• Describe thermal challenges and cooling solutions for thermal management in packaging
• Discuss eco-friendly packaging solutions and regulatory compliance regarding environmental and sustainability considerations
• Predict future directions and innovations of advanced packaging including quantum and neuromorphic packaging and the roadmap for the next decade

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.
Course tropics include:
- Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
- Process Nodes: Process nodes and their impact on device performance and cost-
- Device Physics and Transistor Operation: Principles of device operation and transistor functionality
- Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
- Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
- Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
- Wafer Processing:
-Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
-Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
-Etching and Cleaning Processes: Plasma and wet etching processes
-Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
-Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance-
-Electroplating and Sputtering: Metal deposition techniques used in manufacturing
-Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
-Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
-Semiconductor Industry Ecosystem: The major players in the industry

Learning Objectives:

• Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and eco-system of the semiconductor industry
• Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
• Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals