Kick-off your experience with SEMI U! For the first time in the Northeast, SEMI U will be offering a variety in-person, instructor-led trainings at ASMC and the Women in Semiconductors events. These trainings will be hosted the day before the event on Monday, May 5.

Hilton Albany
Rooms: TBD

9:30am - 5:00pm

Pass Fees + $695

$795

+ $695 in addition to fees already paid. 

Trainings Available

Name
Understanding Semiconductor Technology & Business
Date & Time
Monday, May 5, 2025, 9:30 AM - 5:00 PM
Description

 

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.

The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies. Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Learning Objectives:

  • Understand the fundamental principles and theories semiconductor technology.
  • Communicate with other associates and understand wafer processing steps.
  • Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
  • Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device.
  • Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
  • Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
  • Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
  • Analyze and evaluate research literature in semiconductor technology.
  • Develop critical thinking and problem-solving skills applicable to semiconductor technology.
Session Type
Workshop

Name
Advanced IC Packaging & Assembly
Date & Time
Monday, May 5, 2025, 9:30 AM - 5:00 PM
Description

 

This course addresses IC packaging, assembly, and chip/substrate interconnections. It stresses the impact of the IC and end product requirements, i.e., “smaller, better, cheaper” and their influence on the manufacturing processes. Topics include all types of packages including ball grid arrays, flip chip, fanout, leadframe, stacked die, stacked packages, System-in-Package, and chip scale packages, and assembly technologies – Chip & Wire, Tape Automated Bonding, and Flip Chip.  The growing importance of packaging as a way to deliver high integration and performance in today's products through heterogeneous integration of chiplets or 3D hybrid bonding will be discussed. This course is suitable for anyone seeking a better understanding of the assembly and packaging of semiconductor devices.

Learning Objectives:

  • Recognize advanced packaging trends of emerging technologies and market demand and drivers
  • Identify types of semiconductor packaging including different packaging techniques and selection criteria
  • Classify material properties and applications and thermal and mechanical properties for packaging
  • Explain assembly techniques and equipment including key assembly processes and equipment and tooling requirements
  • Discover reliability and testing protocols including stress testing and failure analysis
  • Describe thermal challenges and cooling solutions for thermal management in packaging
  • Discuss eco-friendly packaging solutions and regulatory compliance regarding environmental and sustainability considerations
  • Predict future directions and innovations of advanced packaging including quantum and neuromorphic packaging and the roadmap for the next decade
Session Type
Workshop

Special Pricing for Students and Veterans

SEMI University provides technical education to equip you with the skills needed for a prosperous journey in the semiconductor sector. Students and Veterans are invited to take advantage of this opportunity at a discounted rate of $595. If you plan on staying for the ASMC Program, this option is on offer on top of the $100 Student Pass Rate.  Alternately, you can choose the Women In Semiconductors Pass at the complimentary rate and add the SEMI U course for $595 there. 

$100 for ASMC Pass and $595 for SEMI U

Complimentary Pass and $595 for SEMI U

Ready to Join a SEMI U Pre-Show Training?

Attendees are welcome to attend this program as a one day only pass for $895*. Alternately, a session can be added to a ASMC or Women in Semiconductors pass for $795*. Students will have a further discounted rate of $695 on offer with the Student Pass.